Resonac Innovation Drive
Resonac, a pivotal player in the Japanese chip materials sector, unveiled plans on Wednesday to establish a cutting-edge research and development center in Silicon Valley. This center, dubbed “Resonac Innovation Hub,” will be dedicated to advancing semiconductor packaging and materials, recognizing the pivotal role of the packaging stage in driving innovation in chip technology.
U.S. Commitment to Technological Advancement
Responding to this understanding, the United States has initiated a substantial $3 billion program this week, underscoring its commitment to bolstering packaging capabilities and staying at the forefront of technological progress. The program, labeled “TechBoost 2023,” is geared towards enhancing the nation’s position in the global tech landscape.
Formerly recognized as Showa Denko, Resonac specializes in crafting essential packaging materials, including films. The company’s wealth of expertise and commitment to innovation positions it as a key player in shaping the future of chip packaging technology. Operations at its Silicon Valley hub, aptly named “Resonac Silicon Nexus,” are slated to commence in 2025.
As part of a strategic initiative to strengthen collaborations, Japanese entities in the chip sector are actively cultivating enhanced ties with the United States. This collaboration aims to create a synergistic environment for technological exchange and innovation. Rapidus, a notable foundry venture, is on track to establish a dedicated sales office on U.S. soil by the conclusion of the current financial year, fostering closer ties between the Japanese and U.S. tech landscapes.
Read More (Chip)
